Invention Grant
- Patent Title: 3D printed sensor and cushioning material
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Application No.: US15679987Application Date: 2017-08-17
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Publication No.: US10285267B2Publication Date: 2019-05-07
- Inventor: Todd Sean Harple , Francis Anthony Bitonti , Peter Emery Wildfeuer
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight and Zimmerman, LLC
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; H05K1/16 ; H05K3/12 ; B33Y80/00 ; B33Y10/00

Abstract:
Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example 3D-printed structure includes a first conductive substrate, a second conductive substrate and a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction.
Public/Granted literature
- US20190059155A1 3D PRINTED SENSOR AND CUSHIONING MATERIAL Public/Granted day:2019-02-21
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