Invention Grant
- Patent Title: Printed circuit board and method of manufacturing the same
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Application No.: US15606102Application Date: 2017-05-26
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Publication No.: US10285268B2Publication Date: 2019-05-07
- Inventor: Gi Gon Park
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: LRK Patent Law Firm
- Priority: KR10-2016-0065589 20160527
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H05K1/03 ; H05K3/00 ; H05K3/40 ; H05K3/46 ; H05K3/38 ; H05K3/42 ; H05K3/10
Abstract:
A printed circuit board (PCB) includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a first seed layer disposed on the substrate and including a nitride, and a metal layer disposed on the first seed layer.
Public/Granted literature
- US20170347450A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-11-30
Information query
