A multilayer ceramic electronic component includes a multilayer ceramic capacitor, first and second metal frames, and an insulating cover. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked together and first and second internal electrodes alternately disposed between pairs of adjacent dielectric layers, and external electrodes disposed on two end surfaces of the ceramic body opposite each other in a length direction orthogonal to the stacking direction. The first and second metal frames are each disposed along a respective one of two end surfaces of the multilayer ceramic capacitor opposite each other in the length direction, and are each disposed along upper and lower surfaces of the multilayer ceramic capacitor. The insulating cover is disposed to enclose the multilayer ceramic capacitor and upper surfaces of the first and second metal frames. A board can have the multilayer ceramic electronic component mounted thereon.