An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.