The instant disclosure provides a dynamic random access memory (DRAM) module including a housing, a circuit board and a fluorine engineered fluid. The housing includes an accommodating space and an opening on a side thereof. The circuit board has at least a DRAM chip disposed thereon. The circuit board is received in the accommodating space and one end of the circuit board has at least a circuit contact protruding from the opening to the exterior of the housing. The fluorine electronic engineering fluid is sealed in the accommodating space and is thermally connected to at least one of the DRAM chip.