Invention Grant
- Patent Title: Positive relief forming of polycrystalline diamond structures and resulting cutting tools
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Application No.: US15359019Application Date: 2016-11-22
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Publication No.: US10293467B2Publication Date: 2019-05-21
- Inventor: David P. Miess
- Applicant: US SYNTHETIC CORPORATION
- Applicant Address: US UT Orem
- Assignee: US SYNTHETIC CORPORATION
- Current Assignee: US SYNTHETIC CORPORATION
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- Main IPC: B24D3/02
- IPC: B24D3/02 ; B24D18/00 ; B24D3/00 ; B24D11/00 ; C09K3/14
Abstract:
Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
Public/Granted literature
- US20170072539A1 POSITIVE RELIEF FORMING OF POLYCRYSTALLINE DIAMOND STRUCTURES AND RESULTING CUTTING TOOLS Public/Granted day:2017-03-16
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