Invention Grant
- Patent Title: Target cooling through gun drilled holes
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Application No.: US13420996Application Date: 2012-03-15
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Publication No.: US10294559B2Publication Date: 2019-05-21
- Inventor: Yoshiaki Tanase , Makoto Inagawa , Akihiro Hosokawa
- Applicant: Yoshiaki Tanase , Makoto Inagawa , Akihiro Hosokawa
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Charles S. Guenzer
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34

Abstract:
A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.
Public/Granted literature
- US20120175250A1 Target Cooling Through Gun Drilled Holes Public/Granted day:2012-07-12
Information query
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