Invention Grant
- Patent Title: Stable electroless copper plating compositions and methods for electroless plating copper on substrates
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Application No.: US16034700Application Date: 2018-07-13
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Publication No.: US10294569B2Publication Date: 2019-05-21
- Inventor: Alejo M. Lifschitz Arribio , Donald E. Cleary
- Applicant: Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Main IPC: C23C18/40
- IPC: C23C18/40 ; C23C18/18 ; C23C18/30

Abstract:
A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
Public/Granted literature
- US20190106792A1 STABLE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS FOR ELECTROLESS PLATING COPPER ON SUBSTRATES Public/Granted day:2019-04-11
Information query
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