- Patent Title: Wafer treating device and sealing ring for a wafer treating device
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Application No.: US15064716Application Date: 2016-03-09
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Publication No.: US10295063B2Publication Date: 2019-05-21
- Inventor: Dieter Albert , Michael Braun
- Applicant: SUSS MicroTec Lithography GmbH
- Applicant Address: DE Garching
- Assignee: SUSS MICROTEC LITHOGRAPHY GMBH
- Current Assignee: SUSS MICROTEC LITHOGRAPHY GMBH
- Current Assignee Address: DE Garching
- Agency: Hayes Soloway PC
- Priority: NL2014625 20150413
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; F16J15/3252 ; F16J15/3268 ; F16J15/3228 ; F16J15/3276
Abstract:
A sealing ring for attaching to a cover ring of a wafer treating device has an annular carrier and a sealing lip which is releasably attached to the carrier.
Public/Granted literature
- US20160300751A1 Wafer Treating Device and Sealing Ring for a Wafer Treating Device Public/Granted day:2016-10-13
Information query
IPC分类:
