Invention Grant
- Patent Title: Clip device
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Application No.: US15382464Application Date: 2016-12-16
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Publication No.: US10295084B2Publication Date: 2019-05-21
- Inventor: Katsutoshi Izawa
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Reising Ethington, P.C.
- Priority: JP2015-247034 20151218
- Main IPC: F16L3/10
- IPC: F16L3/10 ; F16L3/237 ; F16L3/223 ; B60R16/02

Abstract:
A clip device that can be fixed to and detached from a pipe as desired. A clip main body is provided with insertion holes into which pipes can be inserted, and elastic holding pieces that face the insertion holes. A bracket is separate from the clip main body and can be attached to and detached from the clip main body. The bracket is provided with an attachment portion that can be attached to a body (vehicle), and pressing portions that press the elastic holding pieces against the outer circumferences of the pipes in the state where the bracket has been assembled together with the clip main body.
Public/Granted literature
- US20170175932A1 CLIP DEVICE Public/Granted day:2017-06-22
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