Invention Grant
- Patent Title: Thermal management using phase change material
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Application No.: US14974801Application Date: 2015-12-18
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Publication No.: US10295283B2Publication Date: 2019-05-21
- Inventor: Michael K. Patterson , Andrew C. Alduino
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: F28F27/00
- IPC: F28F27/00 ; F28D20/02 ; H01L23/34 ; H01L23/427 ; G02B6/00 ; G02B6/42 ; F28D21/00

Abstract:
Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.
Public/Granted literature
- US20170176118A1 THERMAL MANAGEMENT USING PHASE CHANGE MATERIAL Public/Granted day:2017-06-22
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