Invention Grant
- Patent Title: Integrated cooling system for electronics testing apparatus
-
Application No.: US14184549Application Date: 2014-02-19
-
Publication No.: US10297339B2Publication Date: 2019-05-21
- Inventor: Brent Thordarson , John W. Andberg , Koei Nishiura
- Applicant: Advantest Corporation
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Main IPC: G05D23/00
- IPC: G05D23/00 ; G01R31/10 ; G01R31/00 ; G06F1/20 ; H05K5/00 ; H05K7/20 ; G11C29/56 ; G01R31/28

Abstract:
Example features or aspects of the present invention are described in relation to a small, quiet integrated cooling system for an apparatus for testing electronic devices. Characteristics of the test apparatus including a low noise output, low power consumption and a compact size with a small spatial and volume footprint are selected for deployment and use in a an office like environment. The test apparatus comprises a chassis frame and a cooler frame disposed within the chassis frame and thus integrated within the test apparatus, which has a reduced form factor suitable for the in-office deployment. Embodiments offer the ability to maintain the working fluid at a constant temperature.
Public/Granted literature
- US20150233967A1 INTEGRATED COOLING SYSTEM FOR ELECTRONICS TESTING APPARATUS Public/Granted day:2015-08-20
Information query