Invention Grant
- Patent Title: Composition for forming conductive pattern and resin structure having conductive pattern
-
Application No.: US15504268Application Date: 2015-09-17
-
Publication No.: US10297363B2Publication Date: 2019-05-21
- Inventor: Shin Hee Jun , Dae Ki Lee , Se Hui Sohn , Han Nah Jeong , Cheol-Hee Park , Chee-Sung Park , Jae Hyun Kim , Ha Na Lee
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2014-0123650 20140917; KR10-2015-0130983 20150916
- International Application: PCT/KR2015/009785 WO 20150917
- International Announcement: WO2016/043541 WO 20160324
- Main IPC: H01B5/14
- IPC: H01B5/14 ; H01B1/02 ; H05K1/03 ; H05K3/10 ; H05K3/18 ; C08J7/12 ; C08K3/32 ; C08L69/00 ; C23C18/16 ; C23C18/20 ; C23C18/40 ; H01B1/22
Abstract:
The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.
Public/Granted literature
- US20170236614A1 COMPOSITION FOR FORMING CONDUCTIVE PATTERN AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN Public/Granted day:2017-08-17
Information query
