Invention Grant
- Patent Title: Electronic component conveyance device and method of manufacturing taping electronic component array
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Application No.: US15182115Application Date: 2016-06-14
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Publication No.: US10297399B2Publication Date: 2019-05-21
- Inventor: Masaru Kakuho , Naoto Tanaka
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2015-121298 20150616
- Main IPC: B65G11/08
- IPC: B65G11/08 ; H05K13/02 ; H01G13/00 ; H01G4/30 ; H01G4/012

Abstract:
As an electronic component conveyance device in which an electronic component is unlikely to jam in a conveyance path. A first magnetic force generation unit is provided lateral to a first sidewall in a midstream part. A second magnetic force generation unit is provided downstream of the first magnetic force generation unit and lateral to a second sidewall in the midstream part. The midstream part includes a first transition part connected with an upstream part and a second transition part connected with a downstream part. The first sidewall is parallel to a conveyance direction in the first transition part. The second sidewall extends in a direction different from the conveyance direction in the first transition part. The second sidewall is parallel to the conveyance direction in the second transition part. The first sidewall extends in a direction different from the conveyance direction in the second transition part.
Public/Granted literature
- US20160372275A1 ELECTRONIC COMPONENT CONVEYANCE DEVICE AND METHOD OF MANUFACTURING TAPING ELECTRONIC COMPONENT ARRAY Public/Granted day:2016-12-22
Information query
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