Invention Grant
- Patent Title: Methods of forming a gate contact structure for a transistor
-
Application No.: US15712301Application Date: 2017-09-22
-
Publication No.: US10297452B2Publication Date: 2019-05-21
- Inventor: Ruilong Xie , Hui Zang , Kangguo Cheng , Tenko Yamashita , Chun-Chen Yeh
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/28 ; H01L29/417 ; H01L29/423 ; H01L29/66

Abstract:
One illustrative method disclosed includes selectively forming sacrificial conductive source/drain cap structures on and in contact with first and second source/drain contact structures positioned on opposite sides of a gate of a transistor and removing and replacing the spaced-apart sacrificial conductive source/drain cap structures with first and second separate, laterally spaced-apart insulating source/drain cap structures that are positioned on the first and second source/drain contact structures. The method also includes forming a gate contact opening that extends through a space between the insulating source/drain cap structures and through the gate cap so as to expose a portion of the gate structure and forming a conductive gate contact structure (CB) that is conductively coupled to the gate structure.
Public/Granted literature
- US20190096677A1 METHODS OF FORMING A GATE CONTACT STRUCTURE FOR A TRANSISTOR Public/Granted day:2019-03-28
Information query
IPC分类: