Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US15051034Application Date: 2016-02-23
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Publication No.: US10297476B2Publication Date: 2019-05-21
- Inventor: Jun Sawashima , Akito Hatano , Kenji Kobayashi , Yuta Nishimura , Motoyuki Shimai , Toyohide Hayashi
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2015-35517 20150225; JP2015-35518 20150225
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
A supply flow passage branches into a plurality of upstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis of a substrate. A return flow passage is connected to the upstream flow passage. A downstream heater heats liquid flowing through the upstream flow passage. A downstream switching unit supplies the liquid, supplied to the plurality of upstream flow passages from the supply flow passage, to one of the plurality of discharge ports and the return flow passage, selectively.
Public/Granted literature
- US20160247697A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2016-08-25
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