Invention Grant
- Patent Title: Substrate carrier with integrated electrostatic chuck
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Application No.: US14916019Application Date: 2014-09-18
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Publication No.: US10297483B2Publication Date: 2019-05-21
- Inventor: John M. White , Zuoqian Wang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- International Application: PCT/US2014/056378 WO 20140918
- International Announcement: WO2015/042302 WO 20150326
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/677 ; C23C14/04 ; C23C14/12 ; C23C14/24 ; C23C14/50 ; C23C14/54 ; C23C14/56 ; C23C16/34 ; C23C16/40 ; C23C16/458 ; C23C16/46 ; C23C16/54 ; F26B3/00 ; F27B1/08 ; H01L21/67 ; H01L21/673 ; H05B3/03 ; C23C16/04 ; C23C16/455
Abstract:
A substrate carrier adapted to use in a processing system includes an electrode assembly and a support base. The electrode assembly is configured to generate an electrostatic chucking force for securing a substrate to the substrate carrier. The support base has a heating/cooling reservoir formed therein. The electrode assembly and the support base form an unitary body configured for transport within a processing system. A quick disconnect is coupled to the body and configured to trap a heat regulating medium in the reservoir heating/cooling reservoir when the body is decoupled from a source of heat regulating medium.
Public/Granted literature
- US20160196997A1 SUBSTRATE CARRIER WITH INTEGRATED ELECTROSTATIC CHUCK Public/Granted day:2016-07-07
Information query
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