A method of dicing a bowed or warped semiconductor wafer includes cutting along the saw streets in a first direction on a first half of the wafer, where the first direction is parallel to the bowing, cutting along the saw streets in the first direction on a second half of the wafer opposite to the first half, and step-cutting along the saw streets in the second direction, such that all of the dies are separated from each other, and the sides of the die in the bowing direction are flat and the sides of the die perpendicular to the bowing direction are stepped.