Invention Grant
- Patent Title: Method for dividing wafer into individual chips
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Application No.: US15710557Application Date: 2017-09-20
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Publication No.: US10297501B2Publication Date: 2019-05-21
- Inventor: Masamitsu Agari , Bae Tewoo
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, LTD.
- Priority: JP2016-183870 20160921
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B23K26/00 ; B23K26/53 ; H01L21/683 ; H01L21/67 ; H01L21/786
Abstract:
A wafer has a front face that is partitioned by a plurality of streets crossing with each other into a plurality of regions in each of which a device is formed. A surface protective tape is adhered to the front face of the wafer. Then a laser beam having a wavelength transparent to the wafer is irradiated along the streets from a rear face side of the wafer to form a modified layer inside the wafer. Then the wafer is ground from the rear face side to thin the wafer. When the surface protective tape is applied, the surface protective tape is heated. When the modified layer is formed, cracks extend from the modified layer to the front face of the wafer. When ground, the wafer is divided into individual chips with the cracks serving as boundaries.
Public/Granted literature
- US20180082897A1 PROCESSING METHOD FOR WAFER Public/Granted day:2018-03-22
Information query
IPC分类:
