Invention Grant
- Patent Title: Fingerprint sensor and manufacturing method thereof
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Application No.: US15131967Application Date: 2016-04-18
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Publication No.: US10297515B2Publication Date: 2019-05-21
- Inventor: Sung Sun Park , Ji Young Chung , Christopher Berry
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0065900 20150512
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/00 ; B81C3/00 ; G06K9/00 ; H01L23/31
Abstract:
A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
Public/Granted literature
- US20160335470A1 FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-11-17
Information query
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