Invention Grant
- Patent Title: Heat sink
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Application No.: US15139539Application Date: 2016-04-27
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Publication No.: US10297524B2Publication Date: 2019-05-21
- Inventor: Hidemitsu Watanabe , Hiroyuki Watanabe , Takafumi Watanabe
- Applicant: APS Japan Co., Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: APS JAPAN CO., LTD.
- Current Assignee: APS JAPAN CO., LTD.
- Current Assignee Address: JP Osaka-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2015-101865 20150519
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/367

Abstract:
To provide a heat sink capable of enhancing heat dissipation performance.Cylindrical bodies 3 have openings 3a of which inner and outer sides are opened on front ends and are provided with through-holes 3b communicating the inner side and the outer side on side walls at the base end side. The cylindrical bodies 3 are provided in a standing manner in a state where portions at the base end side penetrate through a supporting main body 2 and project into a gap s1, the through-holes 3b are opened to the gap s1, and portions at the front end side also project from the surface of the supporting main body 2 at the opposite side to the gap s1. An atmosphere in the gap s1, which contains heat from a cooling target object 9, is capable of being made to flow into the cylindrical bodies 3 through the through-holes 3, circulate in inner spaces of the cylindrical bodies 3, and be released to the outside through the openings 3a on the front ends.
Public/Granted literature
- US20160341492A1 HEAT SINK Public/Granted day:2016-11-24
Information query
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