A semiconductor module includes case that houses a semiconductor device therein and a fastener that is connected at one end thereof to the case. The fastener includes a first extending portion that is connected at one end hereof to the case and extends away from the case, and a second extending portion that is connected at one end thereof to the first extending portion and extends toward the case, where the second extending portion has a variable angle with respect to the first extending portion depending on an external force. The second extending portion has a through hole penetrating through the second extending portion from a front surface of the second extending portion to a back surface of the second extending portion; and a projection that is provided on the back surface of the second extending portion, the projection being positioned closer to the case than the through hole is.