Invention Grant
- Patent Title: Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects
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Application No.: US15357551Application Date: 2016-11-21
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Publication No.: US10297552B2Publication Date: 2019-05-21
- Inventor: Jin Seong Kim , Ye Sul Ahn , Cha Gyu Song
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2013-0126839 20131023
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/538 ; H01L23/498 ; H01L25/10 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the substrate, and a first conductive bump that is on the top surface of the substrate and is at least partially encapsulated by the first mold material. An extended substrate may be coupled to the substrate utilizing the first conductive bump. A second conductive bump may be formed on the bottom surface of the substrate, and a second mold material may encapsulate at least a portion of the second conductive bump and at least a portion of the bottom surface of the substrate. A third mold material may be formed between the first mold material and the extended substrate.
Public/Granted literature
- US20170162510A1 SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-TO-SUBSTRATE INTERCONNECTS Public/Granted day:2017-06-08
Information query
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