Invention Grant
- Patent Title: Electronic device by laser-induced forming and transfer of shaped metallic interconnects
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Application No.: US15962736Application Date: 2018-04-25
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Publication No.: US10297565B2Publication Date: 2019-05-21
- Inventor: Scott A. Mathews , Iyoel Beniam , Alberto Piqué
- Applicant: The United States of America, as represented by the Secretary of the Navy
- Applicant Address: US DC Washington
- Assignee: The United States of America, as represented by the Secretary of the Navy
- Current Assignee: The United States of America, as represented by the Secretary of the Navy
- Current Assignee Address: US DC Washington
- Agency: US Naval Research Laboratory
- Agent Stephen T. Hunnius
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H01L21/48 ; H01L21/768
Abstract:
An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.
Public/Granted literature
- US20180240772A1 Electronic Device By Laser-Induced Forming and Transfer of Shaped Metallic Interconnects Public/Granted day:2018-08-23
Information query
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