Semiconductor device

Invention Grant

US10297593B2 Semiconductor device 有权

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Patent Title: Semiconductor device
Application No.: US15006790

Application Date: 2016-01-26
Publication No.: US10297593B2

Publication Date: 2019-05-21
Inventor: Ryohei Gejo
Applicant: Kabushiki Kaisha Toshiba
Applicant Address: JP Tokyo
Assignee: Kabushiki Kaisha Toshiba
Current Assignee: Kabushiki Kaisha Toshiba
Current Assignee Address: JP Tokyo
Agency: White & Case LLP
Priority: JP2015-014168 20150128
Main IPC: H01L29/739
IPC: H01L29/739 ; H01L27/07 ; H01L29/08 ; H01L29/861 ; H01L27/06 ; H01L29/36 ; H01L29/40

Abstract:

According to one embodiment, a semiconductor device includes a first region having an insulated gate bipolar transistor and a second region having a diode. The first region and the second region are formed in a same chip. A breakdown voltage of the second region is lower than a breakdown voltage of the first region.

Public/Granted literature

US20160218101A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-07-28

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/68	..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的（H01L29/96优先）
H01L29/70	...双极器件
H01L29/72	....晶体管型器件，如连续响应于所施加的控制信号的
H01L29/739	.....受场效应控制的