Cross-point memory with self-defined memory elements
Abstract:
Some embodiments include a memory device having first structures arranged in a first direction and second structures arranged in a second direction. At least one structure among the first and second structures includes a semiconductor material. The second structures contact the first structures at contact locations. A region at each of the contact locations is configured as memory element to store information based on a resistance of the region. The structures can include nanowires. Other embodiments are described.
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