Invention Grant
- Patent Title: Light emitting package having phosphor layer over a transparent resin layer
-
Application No.: US15759113Application Date: 2017-09-29
-
Publication No.: US10297725B2Publication Date: 2019-05-21
- Inventor: Ki Seok Kim , Won Jung Kim , June O Song , Chang Man Lim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2017-0119047 20170929
- International Application: PCT/KR2017/011089 WO 20170929
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L21/00 ; H01L33/48 ; H01L33/62 ; H01L33/60 ; H01L33/54 ; H01L33/50 ; H01L33/56
Abstract:
The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus.According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
Public/Granted literature
- US20190088824A1 LIGHT EMITTING PACKAGE HAVING PHOSPHOR LAYER OVER A TRANSPARENT RESIN LAYER Public/Granted day:2019-03-21
Information query
IPC分类:
