Invention Grant
- Patent Title: Radar transceiver assemblies with transceiver chips on opposing sides of the substrate
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Application No.: US15173090Application Date: 2016-06-03
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Publication No.: US10297926B2Publication Date: 2019-05-21
- Inventor: Jae Seung Lee , Paul Schmalenberg
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
- Applicant Address: US TX Plano
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US TX Plano
- Agency: Dinsmore & Shohl LLP
- Main IPC: H01Q21/08
- IPC: H01Q21/08 ; G01S7/03 ; H01Q1/22 ; H01Q1/24

Abstract:
The radar transceiver assembly configured to reduce ghost lobes and narrow the receive beams so as to provide a better image resolution relative to current radar transceiver assemblies is provided. The radar transceiver assembly includes a first transceiver chip and a second transceiver chip mounted on opposite sides of the substrate. The accordingly, space on the first support surface may be utilized for antennas. The first array of transmit antennas and first array of receive antennas is interleaved with the second array of transmit antennas and the second array of receive antennas. The second array of transmit antennas and the second array of receive antennas are electrically coupled to the second transceiver chip via a coupling structure.
Public/Granted literature
- US20170352958A1 RADAR TRANSCEIVER ASSEMBLIES WITH TRANSCEIVER CHIPS ON OPPOSING SIDES OF THE SUBSTRATE Public/Granted day:2017-12-07
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