Invention Grant
- Patent Title: Substrate holding structure, electronic component module, and electrical connection box
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Application No.: US15360656Application Date: 2016-11-23
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Publication No.: US10297994B2Publication Date: 2019-05-21
- Inventor: Yoshihito Imaizumi
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2015-235468 20151202
- Main IPC: H02G3/08
- IPC: H02G3/08 ; H01R12/58 ; H01R12/72 ; H05K5/00 ; H05K7/14

Abstract:
A substrate holding structure includes holding units and protrusions. The holding units are provided to a casing that includes an accommodating unit accommodating therein an inserted substrate, and hold an end part of the substrate accommodated in the accommodating unit on the insertion direction-entrance side of the substrate. The protrusions protrude from side wall surfaces that are wall surfaces of the casing along the insertion direction of the substrate, the wall surfaces being opposed to the side surfaces of the substrate, and are plastically deformed due to contact with the substrate to be inserted into the accommodating unit.
Public/Granted literature
- US20170163013A1 SUBSTRATE HOLDING STRUCTURE, ELECTRONIC COMPONENT MODULE, AND ELECTRICAL CONNECTION BOX Public/Granted day:2017-06-08
Information query
IPC分类: