Invention Grant
- Patent Title: Vehicle camera with enhanced imager and PCB assembly
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Application No.: US15076916Application Date: 2016-03-22
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Publication No.: US10298818B2Publication Date: 2019-05-21
- Inventor: Christopher L. Van Dan Elzen
- Applicant: MAGNA ELECTRONICS INC.
- Applicant Address: US MI Auburn Hills
- Assignee: MAGNA ELECTRONICS INC.
- Current Assignee: MAGNA ELECTRONICS INC.
- Current Assignee Address: US MI Auburn Hills
- Agency: Honigman LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/225 ; H04N7/18 ; B60R1/00 ; H05K1/02 ; H05K3/34

Abstract:
A camera for a vision system for a vehicle includes an imager chip having an at least partially light transmitting substrate having a photosensor array disposed at a second surface of the at least partially light transmitting substrate so as to sense light that passes through the at least partially light transmitting substrate. The imager chip includes electrically conductive pads disposed at the second surface of the at least partially light transmitting substrate. A circuit element includes circuitry disposed at least at a third surface thereof. The imager chip is mounted at the circuit element with the second surface of the at least partially light transmitting substrate opposing the third surface of the circuit element. Electrical connection between the electrically conductive pads and the circuitry of the circuit element is made when mounting the imager chip at the circuit element.
Public/Granted literature
- US20160286103A1 VEHICLE CAMERA WITH ENHANCED IMAGER AND PCB ASSEMBLY Public/Granted day:2016-09-29
Information query
IPC分类: