Invention Grant
- Patent Title: Method and apparatus for signal processing by light waveform shaping
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Application No.: US16021470Application Date: 2018-06-28
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Publication No.: US10299020B2Publication Date: 2019-05-21
- Inventor: Chia-Chien Wei
- Applicant: NATIONAL SUN YAT-SEN UNIVERSITY
- Applicant Address: TW Kaohsiung
- Assignee: National Sun Yat-Sen University
- Current Assignee: National Sun Yat-Sen University
- Current Assignee Address: TW Kaohsiung
- Agency: Rosenberg, Klein & Lee
- Main IPC: H04Q11/00
- IPC: H04Q11/00 ; H04B1/00 ; H04B10/27 ; H04B10/50 ; H04B10/516 ; H04B10/40

Abstract:
A method and apparatus for signal processing by light waveform shaping are provided to process an uplink signal generated by a digital-to-analog converter (DAC) and/or process a downlink signal to be transmitted to an analog-to-digital converter (ADC). The method includes adjusting the waveform of the uplink signal and/or the waveform of the downlink signal with a light waveform shaping module so that, even if the DAC and/or ADC has a low sampling rate and a narrow bandwidth, a high-frequency signal portion of the uplink signal and/or a high-frequency signal portion of the downlink signal can be preserved.
Public/Granted literature
- US20180310079A1 METHOD AND APPARATUS FOR SIGNAL PROCESSING BY LIGHT WAVEFORM SHAPING Public/Granted day:2018-10-25
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