Invention Grant
- Patent Title: Modular self-aligning liquid heat removal coupling system for electronic racks
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Application No.: US15438600Application Date: 2017-02-21
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Publication No.: US10299413B2Publication Date: 2019-05-21
- Inventor: Yan Cui , Tianyi Gao , Ali Heydari , Charles J. Ingalz
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01R3/08 ; H05K7/14

Abstract:
An electronic rack includes a back panel, a number of server slots, and a number of server blades inserted therein. The back panel includes a heat removal liquid manifold to provide heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain an information technology (IT) component and a self-fitting coupling assembly having a first liquid intake connector and a first liquid outlet connector to self-align with a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold mounted on the back panel. The first liquid intake connector and the first liquid outlet connector are capable of moving around within a predetermined tolerance space with respect to the server tray.
Public/Granted literature
- US20180242478A1 MODULAR SELF-ALIGNING LIQUID HEAT REMOVAL COUPLING SYSTEM FOR ELECTRONIC RACKS Public/Granted day:2018-08-23
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