Technologies are described for shielding electronic components. In one embodiment, a conductive gasket includes a gasket body. A conductive shield has a plurality of projections extending therefrom sufficient to deform the gasket body to couple the conductive shield and the conductive gasket together. The projections can be pointed teeth designed for penetrating the conductive gasket so as to electrically and mechanically couple the conductive shield to the conductive gasket. The conductive gasket can be stacked onto the conductive shield to form a sidewall, which can be mounted on a PCB. A conductive cover can then be placed on the conductive gasket to create a cavity in which electronic components can be positioned.