Invention Grant
- Patent Title: Component mounting system
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Application No.: US14765945Application Date: 2013-02-22
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Publication No.: US10299418B2Publication Date: 2019-05-21
- Inventor: Hiroaki Muratsuchi , Takashi Kurashina
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/054474 WO 20130222
- International Announcement: WO2014/128913 WO 20140828
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H05K13/08 ; G06F17/50 ; H05K13/02

Abstract:
A component mounting system that efficiently determines a component as a bulk component to be mounted on a bulk feeder through a simulation, and a bulk component determining method. The component mounting system includes a printed-circuit-board conveyance section that includes conveyance lanes and which convey a plurality of different types of printed circuit boards, a component supply section, a mounting head, a bulk feeder, and a bulk component determining section that performs a simulation in which operation times when the components supplied from the component supply section are moved on the printed circuit boards on the conveyance lanes are calculated for all the components and determines the bulk component to be mounted on the bulk feeder based on the calculated operation times.
Public/Granted literature
- US20150382521A1 COMPONENT MOUNTING SYSTEM, AND BULK COMPONENT DETERMINING METHOD USED IN THE SAME Public/Granted day:2015-12-31
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