Invention Grant
- Patent Title: Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor
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Application No.: US15115944Application Date: 2015-02-05
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Publication No.: US10302506B2Publication Date: 2019-05-28
- Inventor: Tsuyoshi Sekitani , Yuki Terakawa , Tomoyuki Yokota , Takao Someya , Jonathan T. Reeder
- Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Applicant Address: JP Kawaguchi-Shi
- Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Current Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Current Assignee Address: JP Kawaguchi-Shi
- Priority: JP2014-021767 20140206
- International Application: PCT/JP2015/053272 WO 20150205
- International Announcement: WO2015/119205 WO 20150813
- Main IPC: G01K7/22
- IPC: G01K7/22 ; C08F220/18 ; C08K3/04 ; C08L33/08 ; H01C7/02 ; H01C17/065 ; C09D7/61 ; C09D5/24 ; C09D133/08 ; H01C17/06

Abstract:
In order to provide a resin composition for temperature sensors that includes a polymer and exhibits high flexibility, higher sensitivity and high cyclic repeatability, a temperature sensor element, a temperature sensor, and a method for producing a temperature sensor, the resin composition (10) for temperature sensors is configured to have conductive particles (2) dispersed in an acrylic polymer (1) obtained by copolymerizing a first acrylic monomer represented by a general formula CH2CHCOOX1 and a second acrylic monomer represented by a general formula CH2CHCOOX2.
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