Invention Grant
- Patent Title: Apparatus and methods for transferring and bonding substrates
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Application No.: US15373634Application Date: 2016-12-09
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Publication No.: US10307300B2Publication Date: 2019-06-04
- Inventor: Eric Shawn Goudy , Jason Lee DeBruler , Michael Devin Long
- Applicant: The Procter & Gamble Company
- Applicant Address: US OH Cincinnati
- Assignee: The Procter & Gamble Company
- Current Assignee: The Procter & Gamble Company
- Current Assignee Address: US OH Cincinnati
- Agent Andrew J. Hagerty; Charles R. Matson; Sarah M. DeCristofaro
- Main IPC: A61F13/15
- IPC: A61F13/15 ; B29C65/00 ; B29C65/02 ; B29C65/10 ; B29C65/48 ; B29L31/48
Abstract:
A substrate assembly is mechanically deformed to form various products. In part, the substrate assembly may advance toward a bonder apparatus. The bonder apparatus rotates about a longitudinal axis and includes a plurality of manifolds. The plurality of manifolds allow for substrate assemblies including different process product pitches to be processed on a single bonder apparatus.
Public/Granted literature
- US20170165120A1 Apparatuses and Methods for Transferring and Bonding Substrates Public/Granted day:2017-06-15
Information query
