An apparatus for controlling a movement of a grinding wheel of a semiconductor wafer grinding system includes: an interface to obtain a feedback signal including grinding force information indicating a force applied to a semiconductor wafer by the grinding wheel; and a control module to generate a control signal for controlling the movement of the grinding wheel based on the grinding force information. The control module generates the control signal to trigger a forward movement of the grinding wheel according to a desired velocity profile during the grinding, if the grinding force information indicates that a force applied by the grinding wheel is below a force threshold. The control module generates the control signal to trigger a movement of the grinding wheel slower than the desired velocity profile during the grinding, if the grinding force information indicates that the force applied by the grinding wheel is above the force threshold.