The purpose of the invention is to provide: a package for EVOH resin pellets which is capable of providing the EVOH resin pellets almost free from powder even in a case where the package contains the powder generated therein during transportation or the like after shipment; and EVOH resin pellets contaminated with very small amount of the powder in a case where a user uses the EVOH resin pellets as a molding material. A package, where pellets each having a substantially circular or oval cross-section are packed in a packaging container whose inner surface has a surface resistivity of 1.0×1014Ω or more, is capable of providing pellets to which 0.8 wt % or less of powder adhered relative to the weight of the pellets.