Invention Grant
- Patent Title: Hot melt adhesive
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Application No.: US15960604Application Date: 2018-04-24
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Publication No.: US10308843B2Publication Date: 2019-06-04
- Inventor: William L. Bunnelle
- Applicant: The Procter & Gamble Company
- Applicant Address: US OH Cincinnati
- Assignee: The Procter & Gamble Company
- Current Assignee: The Procter & Gamble Company
- Current Assignee Address: US OH Cincinnati
- Agent Andrew J. Haggerty
- Main IPC: C09J123/20
- IPC: C09J123/20 ; C09J123/14 ; B32B7/12 ; B32B27/12 ; C08L23/10 ; C08L23/12 ; C08L23/14 ; C08L23/16 ; C09J123/18 ; C08L23/18 ; A61F13/539 ; B32B23/08 ; B32B27/06 ; C09J123/10 ; A61L15/58 ; A61L15/60 ; C09J123/22 ; A61F13/15 ; C09J7/35 ; C09J7/21 ; A61F13/53

Abstract:
A hot melt adhesive material and articles made using the hot melt adhesive to assemble structures in an article. The adhesive material typically is manufactured by blending amorphous polymer with a heterophase polymer having crystallinity into an adhesive composition.
Public/Granted literature
- US20180237664A1 HOT MELT ADHESIVE Public/Granted day:2018-08-23
Information query
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