Invention Grant
- Patent Title: Pressure-sensitive adhesive, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet
-
Application No.: US14115228Application Date: 2012-04-23
-
Publication No.: US10308844B2Publication Date: 2019-06-04
- Inventor: Masatsugu Higashi , Akiko Tanaka , Aimi Matsuura , Kiyoe Shigetomi , Tetsuo Inoue
- Applicant: Masatsugu Higashi , Akiko Tanaka , Aimi Matsuura , Kiyoe Shigetomi , Tetsuo Inoue
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-102968 20110502; JP2012-094877 20120418
- International Application: PCT/JP2012/060864 WO 20120423
- International Announcement: WO2012/150682 WO 20121108
- Main IPC: C09J135/02
- IPC: C09J135/02 ; C09J133/08 ; C09J133/10 ; C09J7/38 ; C09J7/22 ; G02B5/30 ; C08K5/103 ; C08F220/18 ; C08F220/26 ; C09J133/06 ; C09J4/06 ; C08K5/00
Abstract:
A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 19 to 99.5% by weight of an alkyl (meth)acrylate having a branched alkyl group of 10 to 24 carbon atoms at an ester end. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant.
Public/Granted literature
- US20140065417A1 PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE LAYER, AND PRESSURE-SENSITIVE ADHESIVE SHEET Public/Granted day:2014-03-06
Information query
IPC分类:
