Invention Grant
- Patent Title: Generating and enhancing microfracture conductivity
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Application No.: US15038058Application Date: 2014-01-02
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Publication No.: US10308868B2Publication Date: 2019-06-04
- Inventor: Philip D. Nguyen , Ronald G. Dusterhoft
- Applicant: Halliburton Energy Services, Inc.
- Applicant Address: US TX Houston
- Assignee: Halliburton Energy Services, Inc.
- Current Assignee: Halliburton Energy Services, Inc.
- Current Assignee Address: US TX Houston
- Agency: McGuireWoods LLP
- International Application: PCT/US2014/010013 WO 20140102
- International Announcement: WO2015/102628 WO 20150709
- Main IPC: E21B43/26
- IPC: E21B43/26 ; E21B43/267 ; C09K8/80 ; C09K8/66 ; C09K8/70 ; C09K8/92

Abstract:
Methods comprising: introducing a micro-proppant treatment fluid into a formation at a rate and pressure sufficient to create or enhance at least one fracture in a first treatment interval, wherein the micro-proppant treatment fluid comprises a first aqueous base fluid, micro-proppant particulates, and a first aqueous-based surface modification agent (“ASMA”); placing the micro-proppant particulates into the at least one fracture; introducing a surface modification treatment fluid into the subterranean formation, wherein the surface modification treatment fluid comprises a second aqueous base fluid and a second ASMA; coating at least a portion of a face of the at least one fracture with the second ASMA; introducing a macro-proppant treatment fluid into the subterranean formation, wherein the macro-proppant treatment fluid comprises a third base fluid and macro-proppant particulates; and placing the macro-proppant particulates into the at least one fracture.
Public/Granted literature
- US20160304770A1 GENERATING AND ENHANCING MICROFRACTURE CONDUCTIVITY Public/Granted day:2016-10-20
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