Invention Grant
- Patent Title: Stabilization of metallic nanowire meshes via encapsulation
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Application No.: US14841944Application Date: 2015-09-01
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Publication No.: US10309026B2Publication Date: 2019-06-04
- Inventor: Talia S. Gershon , Supratik Guha , Teodor K. Todorov , Theodore G. van Kessel
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Vazken Alexanian
- Main IPC: C25D5/48
- IPC: C25D5/48 ; C25D5/02 ; C25D7/06 ; C25D7/00 ; C23C18/12 ; H01L31/0224

Abstract:
Techniques for mechanically stabilizing metallic nanowire meshes using encapsulation are provided. In one aspect, a method for forming a mechanically-stabilized metallic nanowire mesh is provided which includes the steps of: forming the metallic nanowire mesh on a substrate; and coating the metallic nanowire mesh with a metal oxide that encapsulates the metallic nanowire mesh to mechanically-stabilize the metallic nanowire mesh which permits the metallic nanowire mesh to remain conductive at temperatures greater than or equal to about 600° C. A mechanically-stabilized metallic nanowire mesh is also provided.
Public/Granted literature
- US20170058418A1 Stabilization of Metallic Nanowire Meshes Via Encapsulation Public/Granted day:2017-03-02
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