Invention Grant
- Patent Title: Process additives to reduce etch resist undercutting in the manufacture of anode foils
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Application No.: US15459808Application Date: 2017-03-15
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Publication No.: US10309033B2Publication Date: 2019-06-04
- Inventor: Ralph Jason Hemphill , Timothy R. Marshall , Thomas F. Strange
- Applicant: Pacesetter, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Pacesetter, Inc.
- Current Assignee: Pacesetter, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Theresa A. Raymer
- Main IPC: C25F3/04
- IPC: C25F3/04

Abstract:
Anode foil, preferably aluminum anode foil, is etched using a process of adding an etch resist to the anode foil and treating the foil in an electrolyte bath composition comprising a sulfate, a halide, an oxidizing agent, a surface active agent, and a non-ionic surfactant. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.
Public/Granted literature
- US20180155849A1 PROCESS ADDITIVES TO REDUCE ETCH RESIST UNDERCUTTING IN THE MANUFACTURE OF ANODE FOILS Public/Granted day:2018-06-07
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