Invention Grant
- Patent Title: Ultrasonic thickness reduction inspection method/apparatus
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Application No.: US15360010Application Date: 2016-11-23
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Publication No.: US10309772B2Publication Date: 2019-06-04
- Inventor: Sou Kitazawa , Naoyuki Kono , Shinobu Okido
- Applicant: Hitachi-GE Nuclear Energy, Ltd.
- Applicant Address: JP Hitachi-shi
- Assignee: Hitachi-GE Nuclear Energy, Ltd.
- Current Assignee: Hitachi-GE Nuclear Energy, Ltd.
- Current Assignee Address: JP Hitachi-shi
- Agency: Crowell & Moring LLP
- Priority: JP2015-231203 20151127
- Main IPC: G01B17/02
- IPC: G01B17/02 ; G01N29/44 ; G01N29/50 ; G01N29/04 ; G01N29/11 ; G01N29/34

Abstract:
Chirp waves generated in a transmitting/receiving unit is supplied to ultrasonic sensors. Signals output from the ultrasonic sensors are supplied to the transmitting/receiving unit and summed in a signal processing/recording unit. The signal processing/recording unit performs mutual correlation processing between the summed signals and the chirp waves and calculates a peak generation time difference. Necessity of exchanging a pipe is determined by calculating and recording the thickness of a pipe from the calculated time difference and calculating a difference between thicknesses measured in the past and the present.
Public/Granted literature
- US20170153108A1 Ultrasonic Thickness Reduction Inspection Method/Apparatus Public/Granted day:2017-06-01
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