Provided are an optical module and a transmission equipment in which a decrease in yield due to brazing or soldering is suppressed. Provided is an optical module including a semiconductor optical element, a stem, and a wiring substrate. The stem includes one or more lead terminals. The wiring substrate includes one or more openings through which the one or more lead terminals, respectively, pass. The stem has a placing surface on which the wiring substrate is placed, and two protrusion portions that are arranged on both external sides, respectively, of the wiring substrate. The wiring substrate further includes a ground conductor layer being positioned on a rear surface and two ground conductor patterns that are arranged on regions, respectively, that are in the vicinity of the two protrusion portions, of a front surface, and are electrically connected to the ground conductor layer.