An apparatus for a chuck having particle recesses is provided. In some embodiments, the chuck includes a plurality of impressions and a particle recess. The impressions of the plurality of impressions are laterally spaced and extend into the chuck from a top surface of the chuck to a base surface of the chuck. The base surface of the chuck defines bottom surfaces respectively of the impressions and is spaced between the top surface of the chuck and a bottom surface of the chuck. The particle recess extends in to the chuck from the top surface of the chuck to a location spaced between the base surface of the chuck and the bottom surface of the chuck. In particular, the particle recess is configured to underlie a workpiece alignment mark of a workpiece.