Invention Grant
- Patent Title: Replacement physical layer (PHY) for low-speed peripheral component interconnect (PCI) express (PCIe) systems
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Application No.: US15726566Application Date: 2017-10-06
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Publication No.: US10310585B2Publication Date: 2019-06-04
- Inventor: Shaul Yohai Yifrach , Amit Gil , James Lionel Panian , Ofer Rosenberg , Richard Dominic Wietfeldt
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Withrow & Terranova, PLLC
- Main IPC: G06F1/32
- IPC: G06F1/32 ; G06F13/42 ; G06F1/3234 ; G06F13/40 ; H01L23/29 ; H04L12/931

Abstract:
A replacement physical layer (PHY) for low-speed Peripheral Component Interconnect (PCI) Express (PCIe) systems is disclosed. In one aspect, an analog PHY of a conventional PCIe system is replaced with a digital PHY. The digital PHY is coupled to a media access control (MAC) logic by a PHY interface for PCIe (PIPE) directly. In further exemplary aspects, the digital PHY may be a complementary metal oxide semiconductor (CMOS) PHY that includes a serializer and a deserializer. Replacing the analog PHY with the digital PHY allows entry and exit from low-power modes to occur much quicker, resulting in substantial power savings and reduced latency. Because the digital PHY is operable with low-speed communication, the digital PHY can maintain sufficient bandwidth that communication is not unnecessarily impacted by digital logic of the digital PHY.
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