A memory system for use in a system-in-package device (SiP) is disclosed. The memory system includes two cache memories. The first cache memory is on a first die of the SiP and the second cache memory is on a second die of the SiP. Both cache memories include tag random access memories (RAMs) corresponding to data stored in the corresponding cache memories. The second cache memory is of a different cache level from the first cache memories. Also, the first cache memory is on a first die of the SiP, and the second cache memory includes a first portion on the first die of the SiP, and a second portion on a second die of the SiP. Both cache memories can be checked concurrently for data availability by a single physical address.