Invention Grant
- Patent Title: Simulation method, simulation apparatus, and simulation program
-
Application No.: US15244809Application Date: 2016-08-23
-
Publication No.: US10311176B2Publication Date: 2019-06-04
- Inventor: Yoshitaka Ohnishi , Daiji Ichishima , Shuji Miyazaki
- Applicant: Sumitomo Heavy Industries, Ltd.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2015-173647 20150903; JP2016-017588 20160202
- Main IPC: G06F17/13
- IPC: G06F17/13 ; G06F17/50

Abstract:
A coupled simulation of a structural-elastic phenomenon and a heat conduction phenomenon of a simulation target including plural particles is performed. Here, numerical calculation of a motion equation capable of being transformed into an equation of the same form as that of a heat conduction equation is performed with respect to a term of a spatial temperature distribution and a term of a derivative of temperature with respect to time, to perform a simulation of the heat conduction phenomenon of the simulation target.
Public/Granted literature
- US20170068759A1 SIMULATION METHOD, SIMULATION APPARATUS, AND SIMULATION PROGRAM Public/Granted day:2017-03-09
Information query