Invention Grant
- Patent Title: Thermodynamic-RAM technology stack
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Application No.: US14722626Application Date: 2015-05-27
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Publication No.: US10311357B2Publication Date: 2019-06-04
- Inventor: Alex Nugent , Timothy Molter
- Applicant: KnowmTech, LLC
- Applicant Address: US NM Santa Fe
- Assignee: KnowmTech, LLC
- Current Assignee: KnowmTech, LLC
- Current Assignee Address: US NM Santa Fe
- Agency: Ortiz & Lopez, PLLC
- Agent Kermit D. Lopez; Luis M. Ortiz
- Main IPC: G06N3/08
- IPC: G06N3/08 ; G06N3/04 ; G06N3/06 ; G06N3/063 ; G06N20/00 ; G11C11/54

Abstract:
A thermodynamic RAM technology stack, two or more memristors or pairs of memristors comprising AHaH (Anti-Hebbian and Hebbian) computing components, and one or more AHaH nodes composed of such memristor pairs that form at least a portion of the thermodynamic RAM technology stack. The levels of the thermodynamic-RAM technology stack include the memristor, a Knowm synapse, an AHaH node, a kT-RAM, kT-RAM instruction set, a sparse spike encoding, a kT-RAM emulator, and a SENSE Server.
Public/Granted literature
- US20160148091A1 THERMODYNAMIC RAM TECHNOLOGY STACK Public/Granted day:2016-05-26
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